First MDA AURORA™ Chips Shipped

One of the key and differentiating technologies behind MDA AURORA™ broadband and direct-to-device (D2D) satellite products has reached a landmark phase. We have begun shipping the first of the more than 10,000 Prime 2.0 space-grade chips to be manufactured, tested and designated ready for integration into the satellite’s electronically steered phased array antenna. Designed by MDA Space, these application-specific integrated circuits (ASICs) are the most integrated digital beamforming chips on the market for space-based antenna arrays, and introduce a number of benefits for satellite operators.

A Mighty Brain

The Prime 2.0 mixed-signal ASIC, which combines analog and digital functionalities, is the cornerstone of the MDA AURORA™ direct radiating arrays (DRA). Multiple chips are integrated into the receiving and transmission antennas, and this network digitally processes data to form and steer hundreds of beams in different directions simultaneously. The system is modular, meaning the number of chips can be customized in accordance with the number of antenna elements and beams required.

Currently available in lower frequency L—and S—bands, it delivers truly unique capabilities in higher frequency Ka-band with direct sampling, a feature that MDA Space was the first to demonstrate successfully last year. With direct sampling, the chip forms and steers beams without having to convert to intermediate frequencies before analog to digital conversion. As a result, the system consumes less power and requires fewer hardware components, so the satellite is lighter and comes at a lower cost, while improving flexibility thanks to the advanced digital signal processing embedded in the chip. Most importantly, this enables satellite operators to focus service when and where on the planet their customers need it the most, with agility.

Integration With Precision

The next phase for the Prime 2.0 chips is integration into higher-level assemblies. Just as with pronged plugs that connect to wall outlets, the ASIC is equipped with more than 900 pins to connect to printed circuit boards (PCBs). Organized in a ball grid array, each pin serves a specific function, such as transmitting RF or digital signals.

The PCBs are designed to ensure optimal performance when all of the components are soldered together. Integration will take place on the automated surface-mount technology line (SMT) at our new high-volume manufacturing facility in Montréal.